Given the current state of practice and visions for the future (including AI), certain practices should be reevaluated. This ...
In Proceedings of the SIGGRAPH Asia 2025 Conference Papers, a research team affiliated with UNIST reports a new AI technology ...
Abstract: 3D-IC technology, it may be more appropriate to refer to this as TSV (Through-Si Via) formation technology, has been maturing year by year and is increasingly utilized in advanced ...
Abstract: The technological history is discussed from the birth to the present of 3D flash memory. Further high memory density of 3D flash memory is driven by increasing the number of word line (WL) ...