Abstract: We report a solder-reflow-compatible thermoplastic material that can be deployed in co-packaged optical assemblies with no dimensional change of the material up to $269~^{\circ }$ C. We ...
Abstract: Double-sided system-in-package (SiP) modules have gained popularity for advanced packaging to provide advanced solutions addressing module size, cost, performance, and time-to-market ...
Altus Group, a leading distributor of electronics manufacturing equipment in the UK and Ireland, has reported a rise in enquiries from manufacturers looking for guidance on specifying convection ...
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