In response to the rising focus on sustainable manufacturing practices and corporate social responsibility, there has been a surge of interest in adopting environmentally friendly and green chemicals ...

Metal inks with in-situ curing combined with sophisticated digital printing equipment provide dynamic manufacturing methods ...

About the Ultra ECDP Tool The Ultra ECDP tool is compatible with 6-inch and 8-inch platforms and accommodates 150 millimeter (mm), 159mm and 200mm wafer sizes. The system is configurable with two open ...

Single-wafer wet processing system to support R&D in advanced interconnects and 3D heterogeneous integration applications ...

Interconnects for advanced packaging are at a crossroads as an assortment of new package types are pushing further into the mainstream, with some vendors opting to extend the traditional bump ...

TOKYO--(BUSINESS WIRE)--Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a glass ...