In early autumn, as the heat gradually dissipates, the production intensity in the high-precision PCB manufacturing workshop ...

Electric-field-assisted assembly enables scalable, lithography-free fabrication of logic circuits using 2D semiconductors. It ...

Here is how designers can break functional systems into sub-functional chiplets and use advanced packaging integration ...

TEOS 3D offers ultra-thick inter-die gapfill by leveraging bowed wafer handling and advancements in dielectric deposition.

However, even high-quality 2D materials can have atomic defects, like missing sulfur or selenium atoms, which affect ...

The study, published in Graphene and 2D Materials (Springer), confirmed that HydroGraph’s oxygenated graphene ink coatings dramatically enhanced cooling for high-powered microelectronics, such as ...

They discovered new materials and a more innovative way to deposit aZIF films with precise control over thickness, bringing ...