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Alps Alpine started the sale of geomagnetic sensors with double resolution

Alps Alpine has started selling the new geomagnetic sensor, “HSCDTD015A,” as the successor to the conventional model, ...
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ROHM and Tata Electronics Form Strategic Partnership in the Semiconductor Business

ROHM Co., Ltd., a leading Japanese semiconductor and electronics manufacturer, and Tata Electronics, a pioneering leader in India’s electronics and semiconductor manufacturing sector, announced today ...
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Vector’s and QNX Alloy Kore Attracts Mercedes-Benz in Push Toward Accelerating SDV Development

Vector and QNX, a division of BlackBerry Limited (NYSE: BB; TSX: BB), today unveiled Alloy Kore, a jointly developed Foundational Vehicle Software Platform engineered to simplify and accelerate the ...
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Infineon Technologies and Intel Collaborate to Serve the Rapidly Expanding Trusted Platform Module Market

Neubiberg, Germany – March 5, 2008 – Infineon Technologies AG (IFX: FSE, NYSE) today announced a collaboration with Intel Corporation to serve the expanding TPM (Trusted Platform Module) market.
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Alps Alpine startet Verkauf von geomagnetischen Sensoren mit doppelter Auflösung

München, 8. Januar 2026 – Alps Alpine hat mit dem Verkauf des neuen geomagnetischen Sensors „HSCDTD015A“ als Nachfolger des ...
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Softwarelösung von Keysight sorgt für zuverlässigen Einsatz von KI in sicherheitskritischen Anwendungen

Die integrierte Lösung unterstützt die Entwicklung und Wartung von KI, die Inferenz in der Praxis sowie die Überwachung von Datenabweichungen und Leistung. Böblingen, 8. Januar 2026 – Keysight ...
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Mercedes-Benz evaluiert Vectors und QNX’ Alloy Kore für schnellere SDV-Entwicklung

Las Vegas, NEVADA, 06.01.2026 – Vector und QNX, eine Geschäftseinheit von BlackBerry Limited (NYSE: BB; TSX: BB), haben heute Alloy Kore vorgestellt – eine gemeinsam entwickelte, Foundational Vehicle ...
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ROHM Publishes White Paper on Power Solutions for Next-Generation 800 VDC Architecture

ROHM has released a new white paper detailing advanced power solutions for AI data centers based on the novel 800 VDC architecture, reinforcing its role as a key semiconductor industry player in ...
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Double DPAK: first top-side cooled SMD solution for high power applications

Munich, Germany – 4 June 2018 – Increasing complexity of end products is challenging the design parameters for high power supplies: these require higher power and more efficiency in an even smaller ...
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Vector Launches the World's First Certified Basic Software for Autonomous Driving

Stuttgart, GERMANY, 2024-07-25 – The independent and internationally recognized specialist for functional safety – exida – has once again certified Vector's MICROSAR Classic Safe basic software up to ...
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Das neue PAVE360 Automotive von Siemens beschleunigt die Entwicklung von Fahrzeugen der nächsten Generation durch Validierung unter realen Bedingungen

Heute hat Siemens, ein führendes Industrietechnologieunternehmen, seine PAVE360™ Automotive-Technologie vorgestellt. Dabei handelt es sich um eine neue Kategorie ...
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Vector Introduces Lightweight Embedded Software for Small ECUs – Collaboration with Infineon Leads to New HAL Specification

Stuttgart, GERMANY, 2025-03-06 – Vector completes its modular platform for the development of Software-Defined Vehicles. The new Embedded Software product MICROSAR IO targets low-cost and ...