SAN JOSE, Calif., July 27, 2022 /PRNewswire/ -- NEO Semiconductor, a leading developer of innovative architectures for NAND flash and DRAM memory, today announced the release of its second-generation ...

Micron Technology recently unveiled 176-layer, triple-level-cell (TLC), 3D NAND flash memory with a 30% smaller die size that employs a new replacement-gate (RG) NAND technology. The chips offer a 35% ...

20 nanometer manufacturing processes, you say? We say pshaw, be gone luddite. Sandisk and Toshiba just announced the latest product from their joint venture: a 19nm 64Gb (8GB) X2 memory chip; aka, the ...