EDN

DRAM basics and its quest for thermal stability by optimizing peripheral transistors

For decades, compute architectures have relied on dynamic random-access memory (DRAM) as their main memory, providing temporary storage from which processing units retrieve data and program code. The ...
Semiconductor Engineering

Scaling DRAM Technology To Meet Future Demands: Challenges And Opportunities

Since the invention of the 1T1C bit cell more than 50 years ago, DRAMs have become the main memory of choice for processors in computer systems and many consumer electronics devices. As new use ...
Semiconductor Engineering

Baby Steps Toward 3D DRAM

Flash memory has made incredible capacity strides thanks to monolithic 3D processing enabled by the stacking of more than 200 layers, which is on its way to 1.000 layers in future generations.[1] But ...
EDN

The promise of OTS-only memories for next-gen compute

For several decades, the semiconductor industry has been looking for alternative memory technologies to fill the gap between dynamic random-access memory (DRAM), the compute system’s main memory, and ...
Electronic Design

Understanding Memory’s RowHammer Challenge

Why we need DDR5. Security improvements of DDR5 over DDR4. How RowHammer can be thwarted. Rapid growth in the world’s digital information has driven continued improvements in computing to process, ...