An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress toward very large-format packages, which are expected to approach 10 times the maximum ...

Packaging is a strategic tool that drives revenue, efficiency and brand value across physical and digital channels.

TSMC is exploring a 'radically new' method of semiconductor chip packaging, as the world of AI is simply not slowing down and needs further advancements at every level to keep up. TSMC Is reportedly ...

In a new report from Business Korea, we're hearing that Samsung is making "significant strides" in the semiconductor packaging industry, "positioning itself ahead of TSMC in the Panel Level Packaging ...

Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution ...

EPR has already shown the potential to help us enter an era where sustainable packaging plans apply a new set of three Rs: refine, redesign and reimagine. After decades of limited industry progress ...

As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced packaging ...

Breakthrough yield and device performance at high volume show team can scale company's large-format advanced packaging for customers' cutting-edge applications SINGAPORE, SG / ACCESS Newswire / ...

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...